2024年3月24日发(作者：)

SecEquipment Parameter

Base Pressure

Specification

Process Chamber<5,

ELL<50.

XLL<50

Process Chamber<10,

ELL<20

XLL<20

2% of setpoint

<±10% (full scale)

15 sec on the first step

±2% of setpoint

±2% of setpoint

± 10W of setpoint

>1000/system

Within7 sec

>2.0

±2% of setpoint

<5

<5

>4000

within wafer (1 sigma)< ±3%

within wafer (1 sigma)< ±3%

Cassette to Cassette 1

sigma)<±3%

<30 ea (>0.3um)

Units

mT

Remark

Leak Rate

Process Pressure Tolerance

MFC Accuracy (Digital MFC)

Time to pressure stability

Chamber Bot Temperature

Chamber Top Temperature

RF power spec

Continuous Cycling Run

Without Alarm

RF Stabilization

Heat Exchanger Water

Resistance Spec

Heat Exchanger Temperature

Spec

Pressure Stable time

MFC FLOW Stable time

Etch Rate

mT/min

%

%

Sec

W

pcs

Sec

Mohm

Sec

Sec

A/min

Etch Rate Uniformity

Mechanical Particle Check

Increase（gas flow)

ea